logo

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Functional Film
Created with Pixso.

GB Standard Polyimide Black Film 25-75μm for Secure FPC Coverlay

GB Standard Polyimide Black Film 25-75μm for Secure FPC Coverlay

Brand Name: Guofeng
Model Number: PI1
MOQ: 1 ton
Price: 1.0-2.0 USD/KG
Payment Terms: T/T,L/C,D/P,D/A,Western Union,MoneyGram
Supply Ability: 180000 TON/YEAR
Detail Information
Place of Origin:
HEFEI, CHINA
Certification:
ISO9001, ISO14001, ISO45001, QS production license and ISO/TS16949 UK DAKKS
Thickness:
25μm / 50μm / 75μm (±5%)
Package:
Simple/vertical/suspend/horizontal
Tensile Strength:
≥200 MPa
Dielectric Strength:
≥100 KV/mm
Volume Resistivity:
≥1×10¹⁶ Ω·cm
Moisture Absorption:
<1.0% (24hrs)
Packaging Details:
Pallet
Supply Ability:
180000 TON/YEAR
Highlight:

GB Standard polyimide film

,

black FPC coverlay film

,

25-75μm polyimide film

Product Description

GB Standard Polyimide Black Film – Secure Coverlay for Confidential FPC Applications​

​Product Advantages​

Engineered for maximum circuit protection, our opaque black PI film features:

  • ​Complete Light Blocking​​: >99.5% opacity (L* ≤25) prevents visual tracing

  • ​High-Temperature Endurance​​: 260°C glass transition temperature

  • ​Dimensional Stability​​: 15-25 ppm/°C CTE minimizes thermal stress

GB Standard Polyimide Black Film 25-75μm for Secure FPC Coverlay 0

  • ​Safety Compliant​​: Halogen-free and UL 94 V-0 certified

  • ​Bonding Flexibility​​: Choice of acrylic or epoxy adhesive systems

​Technical Specifications​

Property

Specification

Material

Polyimide

Thickness Options

25/50/75/125μm (±3%)

Custom Widths

500-1500mm available

Tensile Strength

≥200MPa (MD/TD)

Dielectric Strength

≥100kV/mm

Surface Treatment

Corona-treated

​Critical Applications​

  • ​Defense Systems​​: Secure radar/drone circuitry

  • ​Medical Electronics​​: Implantable device protection

  • ​Premium Consumer Tech​​: Foldable display PCBs

  • ​Automotive Safety​​: ADAS camera modules

  • ​Industrial IoT​​: Tamper-proof sensor packaging

​Quality Assurance​

  • ​Anti-Reverse Engineering​​: Defeats optical/IR imaging

  • ​Precision Processing​​: Compatible with laser cutting/die punching

  • ​Custom Options​​: Adjustable opacity (L*15-30) and rigidity

  • ​Full Traceability​​: Complete resin-to-roll documentation

​Processing Parameters​

  • ​Lamination​​: 160-180°C @ 1.0-1.5MPa (3-5 minutes)

  • ​Laser Cutting​​: 355nm UV laser recommended

  • ​Chemical Resistance​​: Stable in IPA and weak acids

​Ordering Information​

  • ​Standard Formats​​: 500/1000mm × 100-300m rolls

  • ​Core Options​​: 3" or 6" industrial cores

  • ​Minimum Order​​: 200kg (samples available)