GB Standard Polyimide Black Film for Confidential FPC Designs
| Material: | Polyimide | Thickness: | 25μm / 50μm / 75μm (±5%) |
| Width: | Customized | Length: | Customized |
| Package: | Simple/vertical/suspend/horizontal | Tensile Strength: | ≥200 MPa |
| Dielectric Strength: | ≥100 KV/mm | Volume Resistivity: | ≥1×10¹⁶ Ω·cm |
| Moisture Absorption: | <1.0% (24hrs) | Adhesion to Copper: | ≥1.0 N/mm (peel) |
| High Light: | GB standard polyimide black film,confidential FPC design film,functional polyimide film with warranty |
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GB Standard Conventional Polyimide Black Film – Opaque Coverlay for Confidential FPC Designs
Product Overview
Our GB Conventional Polyimide Black Film is an opaque, non-transparent coverlay engineered for flexible printed circuits (FPCs) requiring structural confidentiality. With a *matte black finish (L ≤ 25)** and high-temperature resistance, it prevents visual reverse-engineering while providing electrical insulation, mechanical protection, and chemical stability—ideal for military, aerospace, and premium consumer electronics.
Key Features
✔ Light Blocking (Opacity >99.5%) – Conceals circuit traces and layer stacking
✔ High Tg (≥260°C) – Withstands lead-free soldering and reflow processes
✔ Low CTE (15-25 ppm/°C) – Minimizes thermal stress on fine-pitch circuits
✔ Halogen-Free & UL 94 V-0 – Meets strict flame-retardancy standards
✔ Adhesive Options – Acrylic (standard) or epoxy (high-bond)
Applications
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Military/Aerospace FPCs – Radar systems, drone controls
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Medical Implantables – Pacemakers, neurostimulators
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High-End Wearables – Foldable displays, smartwatch PCBs
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Automotive Sensors – ADAS camera flex circuits
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Industrial IoT – Anti-tamper sensor modules
Technical Specifications
|
Property |
Value |
|
Material |
Polyimide |
|
Application |
Artificial Graphite Films,Lithium-Ion Batteries |
|
Thickness Range |
25μm / 50μm / 75μm / 125μm (±3%) |
|
Width |
Customizable (e.g., 500mm - 1500mm) |
|
Surface Treatment |
Corona-treated |
|
Tensile Strength (MD) |
≥200 |
|
Tensile Strength (TD) |
≥200 |
|
Dielectric Strength |
≥100 kV/mm |
Why Choose Our Film?
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IP Protection – Defeats optical/IR imaging for circuit cloning
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Process Compatibility – Laser-cuttable, die-punchable, and photoimageable
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Custom Formulations – Adjustable opacity (L* 15-30) and stiffness
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Supply Chain Security – Full traceability from resin to roll
Product pictures
Processing Guidelines
1. Lamination: 160-180°C @ 1.0-1.5 MPa (3-5 min)
2. Laser Cutting: 355nm UV laser (recommended for <50μm)
3. Chemical Resistance: Stable in IPA, and weak acids
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Standard Formats:
Roll Dimensions: 500mm/1,000mm width x 100-300m length
Core ID: 3" / 6" (industrial cores)
Special Services:
Pre-carbonized films (pre-baked at 600°C)
Custom imidization degrees (for controlled carbonization speed
MOQ: 200kg (sample rolls available)
Request our Graphitization Process Guide with temperature profiles for different end uses!
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