GB Standard Conventional Polyimide Black Film – Opaque Coverlay for Confidential FPC Designs

Product Overview

 
Our GB Conventional Polyimide Black Film is an opaque, non-transparent coverlay engineered for flexible printed circuits (FPCs) requiring structural confidentiality. With a *matte black finish (L ≤ 25)** and high-temperature resistance, it prevents visual reverse-engineering while providing electrical insulation, mechanical protection, and chemical stability—ideal for military, aerospace, and premium consumer electronics.
 
 

Key Features

    ✔ Light Blocking (Opacity >99.5%) – Conceals circuit traces and layer stacking
    ✔ High Tg (≥260°C) – Withstands lead-free soldering and reflow processes
    ✔ Low CTE (15-25 ppm/°C) – Minimizes thermal stress on fine-pitch circuits
    ✔ Halogen-Free & UL 94 V-0 – Meets strict flame-retardancy standards
    ✔ Adhesive Options – Acrylic (standard) or epoxy (high-bond)

Applications

• Military/Aerospace FPCs – Radar systems, drone controls

• Medical Implantables – Pacemakers, neurostimulators

• High-End Wearables – Foldable displays, smartwatch PCBs

•  Automotive Sensors – ADAS camera flex circuits

• Industrial IoT – Anti-tamper sensor modules

Technical Specifications

Why Choose Our Film?

•  IP Protection – Defeats optical/IR imaging for circuit cloning

•  Process Compatibility – Laser-cuttable, die-punchable, and photoimageable

•  Custom Formulations – Adjustable opacity (L* 15-30) and stiffness

•  Supply Chain Security – Full traceability from resin to roll

Product pictures

Processing Guidelines

1. Lamination: 160-180°C @ 1.0-1.5 MPa (3-5 min)
2. Laser Cutting: 355nm UV laser (recommended for <50μm)
3. Chemical Resistance: Stable in IPA, and weak acids

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Standard Formats: