Low Temperature Low Shrinkage BOPET Base Film Heat Stabilized for Electrical Insulation
Propriétés de base
Lieu d'origine:
Hefei, Anhui, Chine
Nom de la marque:
Guofeng
Attestation:
ISO9001, ISO14001, ISO45001, FDA/EU food contact
Propriétés commerciales
Quantité minimum de commande:
500 kg
Prix:
Négociable
Conditions de paiement:
LC, D/A, D/P, T/T, Western Union,
Capacité d'approvisionnement:
180 000 tonnes par an
Caractéristiques
| Material: | BOPET | Film Type: | Film de base BOPET stabilisé à la chaleur |
| Thickness: | 4,5 / 6 / 8 / 10 / 12 µm | Width: | 500 à 1600 mm |
| Thermal Shrinkage (150℃/30min): | ≤0,5% | Tensile Strength MD / TD: | ≥200 MPa / ≥200 MPa |
| Heat Resistance: | Utilisation continue jusqu'à 180 ℃ | Application: | Isolation électrique, condensateurs, moteurs, transformateurs, circuits flexibles |
| High Light: | Low Temperature Shrink Resistant BOPET Film,Heat Stabilized Polyester Film,Electrical Insulation Base Film |
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Description du produit
Low Temperature Low Shrinkage BOPET Base Film Heat Stabilized for Electrical Insulation Product Description / Production Introduction This low temperature low shrinkage BOPET base film is a heat stabilized biaxially oriented polyethylene terephthalate film engineered for electrical insulation and precision electronic applications. A dedicated heat stabilization process delivers very low thermal shrinkage of no more than 0.5 percent at 150 degrees Celsius for 30 minutes, so