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Low Temperature Low Shrinkage BOPET Base Film Heat Stabilized for Electrical Insulation

Propiedades básicas
Lugar de origen: Hefei, Anhui, China
Nombre de la marca: Guofeng
Proceso de dar un título: ISO9001, ISO14001, ISO45001, FDA/EU food contact
Propiedades comerciales
Cantidad mínima de pedido: 500 kilogramos
Precio: Negociable
Condiciones de pago: LC, D/A, D/P, T/T, Western Union,
Capacidad de suministro: 180.000 toneladas al año
Presupuesto
Material: BOPET Film Type: Película base BOPET estabilizada térmicamente
Thickness: 4,5 / 6 / 8 / 10 / 12 µm Width: 500 a 1600 mm
Thermal Shrinkage (150℃/30min): ≤0,5% Tensile Strength MD / TD: ≥200MPa/≥200MPa
Heat Resistance: Uso continuo hasta 180 ℃ Application: Aislamiento Eléctrico, Condensadores, Motores, Transformadores, Circuitos Flexibles
High Light:

Low Temperature Shrink Resistant BOPET Film

,

Heat Stabilized Polyester Film

,

Electrical Insulation Base Film

Descripción del Producto
Low Temperature Low Shrinkage BOPET Base Film Heat Stabilized for Electrical Insulation Product Description / Production Introduction This low temperature low shrinkage BOPET base film is a heat stabilized biaxially oriented polyethylene terephthalate film engineered for electrical insulation and precision electronic applications. A dedicated heat stabilization process delivers very low thermal shrinkage of no more than 0.5 percent at 150 degrees Celsius for 30 minutes, so