Low Temperature Low Shrinkage BOPET Base Film Heat Stabilized for Electrical Insulation
Propiedades básicas
Lugar de origen:
Hefei, Anhui, China
Nombre de la marca:
Guofeng
Proceso de dar un título:
ISO9001, ISO14001, ISO45001, FDA/EU food contact
Propiedades comerciales
Cantidad mínima de pedido:
500 kilogramos
Precio:
Negociable
Condiciones de pago:
LC, D/A, D/P, T/T, Western Union,
Capacidad de suministro:
180.000 toneladas al año
Presupuesto
| Material: | BOPET | Film Type: | Película base BOPET estabilizada térmicamente |
| Thickness: | 4,5 / 6 / 8 / 10 / 12 µm | Width: | 500 a 1600 mm |
| Thermal Shrinkage (150℃/30min): | ≤0,5% | Tensile Strength MD / TD: | ≥200MPa/≥200MPa |
| Heat Resistance: | Uso continuo hasta 180 ℃ | Application: | Aislamiento Eléctrico, Condensadores, Motores, Transformadores, Circuitos Flexibles |
| High Light: | Low Temperature Shrink Resistant BOPET Film,Heat Stabilized Polyester Film,Electrical Insulation Base Film |
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Descripción del Producto
Low Temperature Low Shrinkage BOPET Base Film Heat Stabilized for Electrical Insulation Product Description / Production Introduction This low temperature low shrinkage BOPET base film is a heat stabilized biaxially oriented polyethylene terephthalate film engineered for electrical insulation and precision electronic applications. A dedicated heat stabilization process delivers very low thermal shrinkage of no more than 0.5 percent at 150 degrees Celsius for 30 minutes, so